Taiwan Semiconductor | 2330 - Loan Capital


Taiwan Semiconductor reported TWD815.04B in Loan Capital for its fiscal quarter ending in June of 2026.





Loan Capital Change Date
Advanced Micro Devices USD 2.35B 1000K Jun/2026
Applied Materials USD 5.26B 1.2B Mar/2026
ASML Holding 1.98B 721.2M Jun/2026
Catcher Technology TWD 532.92M 2.18M Mar/2026
Hou Hai Precision TWD 306.09B 8.18B Dec/2025
Intel USD 48.55B 5.52B Jun/2026
Jentech Precision TWD 44.97M 1.72M Mar/2026
Lam Research USD 3.73B 106K Jun/2026
Largan Precision TWD 107.18M 31.93M Mar/2026
Lenovo USD 3.86B 566.95M Mar/2026
Mediatek TWD 8.5B 38.63M Jun/2026
Micron Technology USD 3.05B 6.51B Mar/2026
Nvidia USD 7.47B 1000K Mar/2026
Qualcomm USD 12.78B 1.99B Jun/2026
Seagate Technology USD 3.38B 85M Jun/2026
Semiconductor Manufacturing International USD 10B 2.08B Dec/2025
Shenzhen Goodix Technology CNY 24.42M 1.82M Mar/2026
Silicon Motion Technology USD 0 0 Mar/2025
Taiwan Semiconductor TWD 815.04B 85.98B Jun/2026
Taiwan Semiconductor Mfg TWD 901.02B 44.79B Mar/2026
Tsec TWD 1.71B 141.66M Dec/2025
Western Digital USD 2.43B 28M Dec/2025